Semiconductor Packaging: Materials Interaction and Reliability

1st Edition

Andrea Chen, Randy Hsiao-Yu Lo

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CRC Press
Published April 19, 2016
Reference - 216 Pages
ISBN 9780429063350 - CAT# KE74685

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Summary

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The boo

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