1st Edition

Handbook of Thin Film Deposition Techniques Principles, Methods, Equipment and Applications, Second Editon

By Krishna Seshan Copyright 2002

    The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition.

    This second edition explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of submicron dimensions. The book covers PVD, laser and E-beam assisted deposition, MBE, and ion beam methods to bring together all of the physical vapor deposition techniques. The book also includes coverage of chemical mechanical polishing that helps attain the flatness that is required by modern lithography methods and new materials used for interconnect dielectric materials, specifically organic polyimide materials.

    Recent Changes in the Semiconductor Industry
    Deposition Technologies and Applications: Introduction and Overview
    Silicon Epitaxy by Chemical Vapor Deposition
    Chemical Vapor Deposition of Silicon Dioxide Films
    Metal Organic Chemical Vapor Deposition: Technology and Equipment
    Feature Scale Modeling
    The Role of Metrology and Inspection in Semiconductor Processing
    Contamination Control, Defect Detection, and Yield Enhancement in Gigabit Manufacturing
    Sputtering and Sputter Deposition
    Laser and Electron Beam Assisted Processing
    Molecular Beam Epitaxy: Equipment and Practice
    Ion Beam Deposition
    Chemical Mechanical Polishing
    Organic Dielectrics in Multilevel Metalization of Integrated Circuits
    Performance, Processing, and Lithography Trends
    Index

    Biography

    Krishna Seshan