Xing-Chang Wei received the Ph. D degree in electrical engineering from the Xi’an University of Electronic Science and Technology, China, in 2001. From 2001 to 2010, he was with the A*STAR Institute of High Performance Computing, Singapore, as a Research Fellow, Senior Research Engineer, and then Research Scientist. He received the 2007 Singapore Institution of Engineers Prestigious Engineering Achievement Award for his contribution on the development of a novel electromagnetic compatibility (EMC) measurement facility. In 2010, he joined Zhejiang University, Hangzhou, China, as a Full Professor, and received the New Century Excellent Talents Award from China Ministry of Education.
Areas of Research / Professional Expertise
His main research interests include power integrity (PI), signal integrity (SI), and electromagnetic interference (EMI) simulation and design for high-speed printed circuit boards, through interposer vias analysis, and the development of fast algorithms for computational electromagnetics. He has more than 10 years research experiences of the EMC modeling and design of the high-speed printed circuit boards and packaging. He has authored/co-authored more than 50 papers published in IEEE Transactions and IEEE international conferences in this area. He proposed the integral equation methods for the efficient simulation of power/ground planes in high-speed printed circuit boards, and this work was honoured with the Best Symposium Paper Award in 2012 Asia-Pacific Symposium on Electromagnetic Compatibility and FY09 Best Paper Award of Institute of High Performance Computing, Singapore. His another work about the cylindrical waves modeling of through interposer vias achieves the Outstanding Paper Award on 15th International Conference on Electronics Packaging Technology.  Currently he is teaching the graduated course “Electromagnetic Compatibility: Principles and Designs for High-Speed Circuits” in Zhejiang University, China.
He is very active in the electromagnetic compatibility research area. He was the Co-Chair of the Technical Program Committee of the 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, and severed as the TPC member and Program Chair of 2010, 2011, 2012 and 2013 Asia-Pacific Symposium on Electromagnetic Compatibility respectively. He also delivered many workshops about signal integrity, power integrity and EMC of high-speed circuits on 2011- 2017  Asia-Pacific Symposium on Electromagnetic Compatibility and other Universities.
He had finished/conducted several related projects, including “Signal integrity and power integrity analysis of high-speed integrated circuits” supported by Singapore government, “High frequency electromagnetic modeling and optimization of TSV-based 3D integration” supported by National Natural Science Foundation of China, “EM analysis of TSV-based 3D interposer” supported by Zhejiang Province Natural Science Foundation of China, and so on. He also had some industrial projects with Huawei Company in China to solve their practical EMC problems in their high-speed IT products.