Through Silicon Vias: Materials, Models, Design, and Performance

Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam

August 26, 2016 by CRC Press
Reference - 216 Pages - 28 Color & 108 B/W Illustrations
ISBN 9781498745529 - CAT# K26947

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•Exclusive title addressing the issues related to graphene based filler materials in TSVs of 3D intergarted circuits

•Rigorous comparison amongst different TSVs especially graphene based TSV with introduction of equivalentmodels

•Detailed information on fabrication and packaging techniques of Through Silicon Vias

•Application of MCB and MLGNR as filler materials in TSVs included

•Comes with homework problems, case studies, examples and powerpoint slides


Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.


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