1st Edition

Optical Inspection of Microsystems

Edited By Wolfgang Osten Copyright 2007
    532 Pages 479 B/W Illustrations
    by CRC Press

    Where conventional testing and inspection techniques fail at the micro-scale, optical techniques provide a fast, robust, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands.

    Optical Inspection of Microsystems is the first comprehensive, up-to-date survey of the most important and widely used full-field optical metrology and inspection technologies. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moiré techniques, interference microscopy, laser Doppler vibrometry, holography, speckle metrology, and spectroscopy. They also examine modern approaches to data acquisition and processing. The book emphasizes the evaluation of various properties to increase reliability and promote a consistent approach to optical testing. Numerous practical examples and illustrations reinforce the concepts.

    Supplying advanced tools for microsystem manufacturing and characterization, Optical Inspection of Microsystems enables you to reach toward a higher level of quality and reliability in modern micro-scale applications.

    Image Processing and Computer Vision for MEMS Testing; Markus Hüttel
    Introduction
    Classification of Tasks
    Image Processing and Computer Vision Components
    Processing and Analysis of Image Data
    Commercial and Noncommercial Image Processing and Computer Vision Software
    Image Processing Techniques for the Processing of Fringe Patterns in Optical Metrology
    Conclusion
    References
    Image Correlation Techniques for Microsystems Inspection; Dietmar Vogel and Bernd Michel
    Introduction
    Deformation Measurement by Digital Image Correlation (DIC) Techniques
    Base Equipment for DIC Applications
    Applications of DIC Techniques to Microsystems
    Conclusions and Outlook
    References
    Light Scattering Techniques for the Inspection of Microcomponents and Microstructures; Angela Duparré
    Introduction
    Theoretical Background of Light Scattering
    Measurement Equipment
    Standardization of Light Scattering Methods
    Applications for Microcomponent and Microstructure Inspection
    Combination of Light Scattering and Profilometric Techniques
    Conclusions and Outlook
    References
    Characterization and Measurement of Microcomponents with the Atomic Force Microscope (AFM); F. Michael Serry and Joanna Schmit
    Introduction
    Components of AFM and Principles of AFM Operation
    AFM Imaging Modes
    AFM Nonimaging Modes
    Applications of AFM for Microcomponent Inspection: A Case Study
    Atomic Force Profilometer (AFP) — A Combination of AFM and Stylus Profiler
    Optical Metrology Complementary to AFM
    Conclusions and Outlook
    References
    Optical Profiling Techniques for MEMS Measurement; Klaus Körner, Aiko Ruprecht, and Tobias Wiesendanger
    Introduction
    Principles of Confocal Microscopy
    Principle of Microscopic Depth-Scanning Fringe Projection (DSFP)
    Conclusion
    References
    Grid and Moiré Methods for Micromeasurements; Anand Asundi, Bing Zhao, and Huimin Xie
    Introduction
    Grid or Grating Fabrication Methods
    Micro-Moiré Interferometer
    Moiré Methods Using High-Resolution Microscopy
    Microscopic Grid Methods
    Conclusions
    References
    Grating Interferometry for In-Plane Displacement and Strain Measurement of Microcomponents; Leszek Salbut
    Introduction
    Principle of Grating Interferometry
    Waveguide Grating Interferometry
    Measurement System
    SG Technology
    Exemplary Applications of WGI
    Conclusions
    References
    Interference Microscopy Techniques for Microsystem Characterization; Alain Bosseboeuf and Sylvain Petitgrand
    Introduction
    Interference Microscopes
    Modeling of Two-Beam Homodyne Interference Microscopes
    Static Measurements by Interference Microscopy
    Performance and Issues of Interference Microscopy
    Applications of Interferometric Profilometers in the MEMS Field
    Dynamic Measurements by Interference Microscopy
    Conclusion
    Acknowledgments
    References
    Measuring MEMS in Motion by Laser Doppler Vibrometry; Christian Rembe, Georg Siegmund, Heinrich Steger, and Michael Wörtge
    Introduction
    Laser Doppler Effect and Its Interferometric Detection
    Techniques of Laser Doppler Vibrometry
    Full-Field Vibrometry
    Measuring on Microscopic Structures
    Resolution and Accuracy
    Combination with Other Techniques
    Examples
    Conclusion and Outlook
    References
    An Interferometric Platform for Static, Quasi-Static, and Dynamic Evaluation of Out-Of-Plane Deformations of MEMS and MOEMS; Christophe Gorecki, Michal Jozwik, and Patrick Delobelle
    Introduction
    Interferometric Platform Architecture and Principle of Operation
    Optomechanical Characterization of Membranes by “Pointwise” Deflection Method
    Mechanical Expertise of Scratch Drive Actuators via Interferometric Measurement of Out-of-Plane Microdisplacements
    Dynamic Evaluation of Active MOEMS by Interferometry Using Stroboscopic Technique
    General Conclusion and Outlook
    Acknowledgments
    References
    Optoelectronic Holography for Testing Electronic Packaging and MEMS; Cosme Furlong
    Introduction
    Overview of MEMS Fabrication Processes
    Optoelectronic Holography
    Representative Applications
    Summary
    Acknowledgments
    References
    Digital Holography and Its Application in MEMS/MOEMS Inspection; Wolfgang Osten and Pietro Ferraro
    Introduction
    Theory and Basic Principle of Digital Holography (DH)
    Digital Holographic Interferometry
    Digital Holographic Microscopy (DHM)
    The Application of DH to the Investigation of Microcomponents
    Conclusion
    References
    Speckle Metrology for Microsystem Inspection; Roland Höfling and Petra Aswendt
    Introduction
    Basics
    Applications
    Conclusion
    References
    Spectroscopic Techniques for MEMS Inspection; Ingrid De Wolf
    Introduction
    Raman Spectroscopy (RS)
    Spectroscopic Ellipsometry (SE)
    Dual-Beam Spectroscopy (DBS)
    X-Ray Photoelectron Spectroscopy (XPS)
    High-Resolution Electron Energy Loss Spectroscopy (HREELS)
    Auger Electron Spectroscopy (AES)
    Brillouin Scattering (BS)
    Conclusions
    References
    Index

    Biography

    Osten, Wolfgang

    “The editor of this book has been working in the field of optical metrology for most of his career, so it is no surprise that he has edited a well-balanced and up-to-date picture of the most important optical measurement techniques used for microcomponents inspections. The book describes the basic principles of image correlation, light scattering, atomic force microscopy, moiré methods, grating interferometry, interference microscopy, laser Doppler vibrometry, digital holography, speckle metrology, and spectroscopic techniques, and also their major application for Microsystems testing. … Each chapter includes a reasonable number of references. This book is a welcome addition to the literature on optical inspection. It is an excellent value for any graduate student, application engineer, research laboratory and group working in this field, and also for those who are contemplating using these techniques to solve a specific problem.”
    — Guillermo H. Kaufmann, Instituto de Fisica Rosario, Argentina, in OPN Optics & Photonics News, Vol. 18, No.3, March 2007