1st Edition

Materials for Rigid and Flexible Printed Wiring Boards

By Martin W. Jawitz, Michael J. Jawitz Copyright 2007
    192 Pages 37 B/W Illustrations
    by CRC Press

    Complex electronic circuits and devices are flooding applications in nearly every facet of commercial and industrial activity, from automated equipment to all types of consumer products. Proper selection of materials is crucial to meet the end-use requirements of flexible and rigid printed wiring boards. While there are many useful books and articles on the fabrication of printed circuit boards, Materials for Rigid and Flexible Printed Wiring Boards is the first book to detail the properties of the materials used and how they are made.

    The authors present important manufacturing information and material properties for reinforcement materials, resins, flexible films, copper foils, rigid laminates, high-speed/high-frequency laminates, and metal core and constraining core materials. They offer practical guidance to help designers, engineers, and fabricators choose suitable materials to successfully meet strength, weight, thickness, performance, cost, and other requirements. In most cases, the material data comes directly from manufacturers' data sheets, representing typical values. The book illustrates the comparative strengths and limitations of the materials, highlights their basic properties, and details the manufacturing processes used to make them.

    Offering practical guidance based on years of experience, Materials for Rigid and Flexible Printed Wiring Boards is a one-stop source of crucial information for anyone designing or building printed circuit boards for any application.

    REINFORCEMENT MATERIALS
    Reinforcement Materials-Rigid
    Glass
    Glass Composition
    Glass Fiber Manufacturing
    From Yarn to Fabric
    Glass Types and Construction
    Glass Fabric Weave
    Surfacing Mat, Paper or Veil
    Glass Fiber Paper
    Quartz
    Properties of Glass Fabrics
    Aramids
    Constraining Dielectric Materials (Kevlar®)

    RESINS
    Introduction
    Polyester Resin
    Epoxy
    Polyimide
    Cyanate Ester and Cyanate Ester Blends (BT Resin)
    Polyphenylene Oxide (PPO) Epoxy Blends
    Polytetrafluoroethylene Resin (PTFE)

    FLEXIBLE FILMS
    Introduction
    Types of Flexible Materials
    Adhesives
    Cover Coat/Coverlay
    Bondplies
    Conductive Materials
    Copper Clad Laminates

    COPPER FOILS
    Introduction
    Electrodeposited Copper Foil
    Rolled Copper Foils
    Grades
    Nickel Foil

    LAMINATES, RIGID
    Introduction
    NEMA Grades
    Composite Laminates
    Rigid Laminates (Glass Reinforced)
    Laminates, Rigid Glass Reinforced
    Aramid Laminates
    Prepreg
    Additive Laminates

    HIGH-SPEED/HIGH-FREQUENCY LAMINATES
    Introduction
    High-Speed/High-Frequency Laminates
    Thin Laminates
    Resins
    High-Frequency Laminate Designations
    Laminate Construction
    Bonding
    Dimensional Stability
    Drilling
    References

    METAL CORE AND CONSTRAINING CORE MATERIALS
    Introduction
    Copper-Invar-Copper (CIC)
    Copper-Molybdenum-Copper (CMC)
    Silicon Carbide Reinforced Aluminum (SiC/Al)
    Coefficient of Thermal Expansion Trade-Offs (CTE)
    APPENDIX
    INDEX

    Biography

    Martin W. Jawitz, Michael J. Jawitz