The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them.
Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments.
High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts.
Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Table of Contents
OVERVIEW OF HIGH TEMPERATURE ELECTRONICS
What is High Temperature Electronics?
SELECTION AND USE OF SILICON DEVICES AT HIGH TEMPERATURES
Basic Principles of Semiconductor Junctions
Silicon Bipolar Transistors
Metallization for High Temperature Electronics
Availability and Use of Commercial-Grade Silicon Devices in Power Converters at High Temperature
WIDE BANDGAP SEMICONDUCTORS
GaAs and Other III-V MESFET and Bipolar Devices
Heterojunction Bipolar Devices
SiC Materials and Devices
Metal Contacts on SiC
PASSIVE DEVICE SELECTION AND USE AT HIGH TEMPERATURE
FIRST-LEVEL PACKAGING CONSIDERATIONS FOR THE USE OF ELECTRONIC HARDWARE AT HIGH TEMPERATURES
Wires and Wirebonds
Lead and Leadframe Materials
Hermetic Case Materials and Lids
SECOND- AND THIRD-LEVEL PACKAGING CONSIDERATIONS FOR THE USE OF ELECTRONIC HARDWARE AT HIGH TEMPERATURES
High-Temperature Solder Materials and Conductive Adhesives
Wire and Cable
Connector Housings and Box Materials
THERMAL MANAGEMENT FOR HIGH TEMPERATURE ELECTRONICS
Thermal Management Considerations for Elevated Temperature Operation
Passive Techniques for Low (