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The Handbook of Thin Film Process Technology, CD-ROM reproduces the text version in its entirety, including illustrations and references from the print edition. With full printing functionality, the CD has all of the added benefits associated with CD-ROM technology, such as easy searching and browsing and hypertext linking and bookmarking,. As a bonus, the CD-ROM also contains both 1996 supplements. Some of the other features include:
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Table of Contents
PHYSICAL DEPOSITION TECHNIQUES Thermal Evaporation (Coordinating Editors: E.B. Graper and J. Vossen) Introduction and general discussion (E.B. Graper) Resistance evaporation (E.B. Graper) Electron beam evaporation (E.B. Graper) Ion vapor evaporation (E.B. Graper) Cathodic arc deposition (P.J. Martin) Laser ablation (A. Morimoto and T. Shimizu)
Molecular Beam Epitaxy (Coordinating Editors: S.A. Barnett and J. Poate) Introduction and general discussion (S.A. Barnett and I.T. Ferguson) Semiconductor growth by metalorganic molecular beam epitaxy (MOMBE) (C.R. Abernathy) Gas-source MBE (G.Y. Robinson) Chemical beam epitaxy (T.H. Chiu) Thin film deposition and dopant incorporation by energetic particle sources (S. Strite and H. Morkoc)
Sputtering (Coordinating Editors: S.I. Shah and D. Glocker) Introduction and general discussion (S.I. Shah) Glow discharge sputtering (A.S. Penfold) Magneton sputtering (A.S. Penfold) Ion-beam sputtering (T. Itoh)
CHEMICAL DEPOSITION TECHNIQUES Chemical Vapor Deposition (Coordinating Editor: L. Vescan) Introduction and general discussion (L. Vescan) Metalorganic chemical vapour deposition (MOCVD) (R.D. Dupuis) Photoassisted chemical vapour deposition (S.J.C. Irvine) Thermally activated chemical vapour deposition (L. Vescan) Atomic layer epitaxy (T. Suntola)
PROCESSING TECHNOLOGIES Pattern Transfer (Coordinating Editor: J.W. Coburn Introduction and general discussion (J.W. Coburn) Reactive ion etching (C. Steinbruchel) Ion-beam-based chemical dry etching (C. Steinbruchel) Ion milling (C. Steinbruchel)
REAL-TIME DIAGNOSTICS Introduction and General Discussion (Coordinating Editor: R.W. Collins) Diagnostic Techniques Reflection high-energy electron diffraction as a diagnostic technique (B.A. Joyce) Low-energy electron diffraction (Sheng-Liang Chang and P.A. Thiel) Reflection mass spectroscopy (R. Kaspi)
Optical Diagnostics Infrared emission interferometry (A.J. Springthorpe) Reflectance anisotropy (B. Drevillon) Interferometry as an in situ probe during processing of semiconductor wafers (V.M. Donnelly) Ellipsometry (P. Snyder) Photoluminescence (P.R. Berger) Elastic laser light scattering (B. Gallois)
Other Diagnostics (Coordinating Editor: R. Collins) Quartz monitors and microbalances (J. Krim and C. Daly) Probes of film stress (D. Glocker)
SURFACE MODIFICATION IN VACUUM Processes for Substrate Cleaning (D. Mattox) Surface Treatment for Corrosion and Wear Protection Material aspects of corrosion protection (Cathy Cotell) Ion implantation with beams (Mike Nastasi) Plasma source ion implantation (Donald Rej)
Surface Treatment of Polymers for Adhesion Plasma sources for polymer surface treatment (M.R. Wertheimer and Edward Liston) Surface chemistry of treated polymers (Lou Gerenser)
MATERIALS Hard and Protective Materials Introduction (O. Knotek and A. Schrey) TiN TiAIN TiAIVN CrN ZrN HfN BN Diamond Ni-Cr-B-Si Al-bronze Al2O3-TiO2
Electronic Materials Introduction (K. Cadien and S. Sivaram) GaAs a-Si:H AlGaAs Tellurides CuInSe2 Si Ge Si-Ge W GaN AIN ErAs Quaternaries Silicides SiSnC SiN
Optical Materials Introduction (J. Targove) AIN ZnO PbTiO3 KNbO3
Ferroelectric Materials Introduction (M. Sayer) Bi4Ti3O12 LiNbO3 and LiTaO3 PbTiO3/PbZrTiO3
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