Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

1st Edition

Karl J. Puttlitz, Kathleen A. Stalter

CRC Press
Published February 27, 2004
Reference - 1048 Pages
ISBN 9780824748708 - CAT# DK1274
Series: Mechanical Engineering


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This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.