Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:
printed circuit boards
die attach materials
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
Table of Contents
Properties of Electronics Packaging Materials
Thermal and Thermomechanical Properties
Zeroth-Level Packaging Materials
First-Level Packaging Materials
Second-Level Packaging Materials
Reinforcement Fiber Materials
Flexible Wiring Board Materials
Conductor Metals in Laminates
Third-Level Packaging Materials
Cables and Flex Circuit Materials