Documents the latest advances in device fabrication
Explores the recent trend toward the design of 3D chip layouts
Details the advantages of 3D designs in meeting the system requirements of computationally intensive tasks
Covers state-of-the-art technologies, including carbon nanotube interconnections, nanoimprint lithography, polymer-based wires, discotic liquid crystals, and through-chip connections
Considers the ultimate physical limits of nanocomputation
It is becoming increasingly clear that the two-dimensional layout of devices on computer chips hinders the development of high-performance computer systems. Three-dimensional structures will be needed to provide the performance required to implement computationally intensive tasks.
3-D Nanoelectronic Computer Architecture and Implementation reviews the state of the art in nanoelectronic device design and fabrication and discusses the architectural aspects of 3-D designs, including the possible use of molecular wiring and carbon nanotube interconnections. This is a valuable reference for those involved in the design and development of nanoelectronic devices and technology.
Table of Contents
Introduction 3-D Structures Overview of 3-D Systems and Thermal Considerations Nanolectronic Devices Molecular Electronics Nanoimprint Lithography Carbon Nanotubes Interconnects Polymer-Based Wires Discotic Liquid Crystals Scaffolding of Discotic Liquid Crystals Through-Chip Connections Fault-Tolerance and Ultimate Physical Limits of Nanocomputation
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