3D Integration for VLSI Systems

1st Edition

Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester

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Pan Stanford
Published April 19, 2016
Reference - 350 Pages
ISBN 9780429067464 - CAT# KE75096

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Summary

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

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