1st Edition

Heat Transfer Thermal Management of Electronics

By Younes Shabany Copyright 2010
    524 Pages 291 B/W Illustrations
    by CRC Press

    The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.

    Heat Transfer: Thermal Management of Electronics details how engineers can use intelligent thermal design to prevent heat-related failures, increase the life expectancy of the system, and reduce emitted noise, energy consumption, cost, and time to market. Appropriate thermal management can also create a significant market differentiation, compared to similar systems. Since there are more design flexibilities in the earlier stages of product design, it would be productive to keep the thermal design in mind as early as the concept and feasibility phase.

    The author first provides the basic knowledge necessary to understand and solve simple electronic cooling problems. He then delves into more detail about heat transfer fundamentals to give the reader a deeper understanding of the physics of heat transfer. Next, he describes experimental and numerical techniques and tools that are used in a typical thermal design process. The book concludes with a chapter on some advanced cooling methods.

    With its comprehensive coverage of thermal design, this book can help all engineers to develop the necessary expertise in thermal management of electronics and move a step closer to being a multidisciplinary engineer.

    Introduction

    Semiconductor Technology Trends

    Temperature-Dependent Failures

    Importance of Heat Transfer in Electronics

    Thermal Design Process

     

    Energy, Energy Transfer, and Heat Transfer

    Energy and Work

    Macroscopic and Microscopic Energies

    Energy Transfer and Heat Transfer

    Equation of State

     

    Principle of Conservation of Energy

    First Law of Thermodynamics

    Energy Balance for a Control Mass

    Energy Balance for a Control Volume

     

    Heat Transfer Mechanisms

    Conduction Heat Transfer

    Convection Heat Transfer

    Radiation Heat Transfer

     

    Thermal Resistance Network

    Thermal Resistance Concept

    Series Thermal Layers

    Parallel Thermal Layers

    General Resistance Network

    Thermal Contact Resistance

    Thermal Interface Materials

    Spreading Thermal Resistance

    Thermal Resistance of Printed Circuit Boards (PCBs)

     

    Thermal Specification of Microelectronic Packages

    Importance of Packaging

    Packaging Types

    Thermal Specifications of Microelectronic Packages

    Package Thermal Resistance Network

    Parameters Affecting Thermal Characteristics of a Package

     

    Fins and Heat Sinks

    Fin Equation

    Fin Thermal Resistance, Effectiveness, and Efficiency

    Fins with Variable Cross Sections

    Heat Sink Thermal Resistance, Effectiveness, and Efficiency

    Heat Sink Manufacturing Processes

     

    Heat Conduction Equation

    One-Dimensional Heat Conduction Equation for a Plane Wall

    General Heat Conduction Equation

    Boundary and Initial Conditions

    Steady-State Heat Conduction

    Transient Heat Conduction

    Lumped Systems

     

    Fundamentals of Convection Heat Transfer

    Types of Flows

    Viscous Force, Velocity Boundary Layer, and Friction Coefficient

    Temperature Boundary Layer and Convection Heat Transfer Coefficient

    Conservation Equations

    Boundary Layer Equations

     

    Forced Convection Heat Transfer: External Flows

    Normalized Boundary Layer Equations

    Reynolds Number, Prandtl Number, Eckert Number, and Nusselt Number

    Functional Forms of Friction Coefficient and Convection Heat Transfer Coefficient

    Flow Over Flat Plates

    Flow Across Cylinders

    Cylindrical Pin-Fin Heat Sink

    Procedure for Solving External Forced Convection Problems

     

    Forced Convection Heat Transfer: Internal Flows

    Mean Velocity and Mean Temperature

    Laminar and Turbulent Pipe Flows

    Entry Length and Fully Developed Flow

    Pumping Power and Convection Heat Transfer in Internal Flows

    Velocity Profiles and Friction Factor Correlations

    Temperature Profiles and Convection Heat Transfer Correlations

    Fans and Pumps

    Plate-Fin Heat Sinks

    Problems

     

    Natural Convection Heat Transfer

    Buoyancy Force and Natural Convection Flows

    Natural Convection Velocity and Temperature Boundary Layers

    Normalized Natural Convection Boundary Layer Equations

    Laminar and Turbulent Natural Convection over a Vertical Flat Plate

    Natural Convection Around Inclined and Horizontal Plates

    Natural Convection Around Vertical and Horizontal Cylinders

    Natural Convection in Enclosures

    Natural Convection from Array of Vertical Plates

    Mixed Convection

     

    Radiation Heat Transfer

    Radiation Intensity and Emissive Power

    Blackbody Radiation

    Radiation Properties of Surfaces

    Solar and Atmospheric Radiations

    Radiosity

    View Factors

    Radiation Heat Transfer Between Black Bodies

    Radiation Heat Transfer Between Non-Black Bodies

    Radiation Heat Transfer from a Plate-Fin Heat Sinks

     

    Computer Simulations and Thermal Design

    Heat Transfer and Fluid Flow Equations: A Summary

    Fundamentals of Computer Simulation

    Turbulent Flows

    Solution of Finite-Difference Equations

    Commercial Thermal Simulation Tools

    Importance of Modeling and Simulation in Thermal Design

     

    Experimental Techniques and Thermal Design

    Flow Rate Measurement Techniques

    System Impedance Measurement

    Fan and Pump Curve Measurements

    Velocity Measurement Methods

    Temperature Measurement Techniques

    Acoustic Noise Measurements

    Importance of Experimental Measurements in Thermal Design

     

    Advanced Cooling Techniques

    Heat Pipes

    Liquid Cooling

    Thermoelectric Coolers

    Electrohydrodynamic Flow

    Synthetic Jet

     

    Appendices

     

    Index

    Biography

    Younes Shabany received his BS in mechanical engineering from Sharif University of Technology in Tehran, Iran, in 1991. He then went to Vancouver, Canada where he obtained his MS in mechanical engineering from the University of British Columbia in 1994. He came to the United States and received a Ph.D in mechanical engineering with a minor in aeronautics and astronautics from Stanford University, California, in 1999. Dr. Shabany has over 18 years of experience in thermal-fluid engineering. He is currently Director of Thermal Engineering & Design and Thermal Architect in Advanced Technology Group at Flextronics International USA, Milpitas, California. In this position, he has been leading thermal design activities in Flextronics’ worldwide design centers on a variety of infrastructure, computing, consumer, automobile, medical, and power electronic products. Before Flextronics, he worked for Applied Thermal Technologies, Santa Clara, California, where he was the director for two years. While at Applied Thermal Technologies, he worked with over 60 companies and designed thermal solutions for about as many pieces of electronic equipment including telecom and networking equipment, desktop and laptop computers, biomedical equipment, and consumer products. Dr. Shabany has also been a lecturer at San Jose State University, California, since the summer of 2001. He has taught undergraduate and graduate courses in heat transfer and advanced mathematical analysis including his most favorite course, Heat Transfer in Electronics. He has also advised graduate students on their projects and theses.