1st Edition

Ceramic Interconnect Technology Handbook

Edited By Fred D. Barlow, III, Aicha Elshabini Copyright 2007
    456 Pages 277 B/W Illustrations
    by CRC Press

    Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies.

    Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates.

    Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

    OVERVIEW OF CERAMIC INTERCONNECT TECHNOLOGY; Aicha Elshabini, Gangqiang Wang, and Dan Amey
    Ceramics in Electronic Packaging
    Electrical Properties of Ceramic Substrates
    Mechanical and Physical Properties of Ceramic Substrates
    Design Rules
    Thick Films on Ceramics
    Thin Films on Ceramics
    High-Current Substrates
    Applications
    References
    ELECTRICAL DESIGN, SIMULATION, AND TESTING; Daniel I. Amey and Kuldeep Saxena
    Introduction
    Electrical Properties
    Electrical Design Considerations
    Electrical and Thermal Design Considerations
    Testing and Characterization
    Summary
    References
    THERMOMECHANICAL DESIGN; Al Krum
    Introduction
    Fundamentals of Heat Transfer
    Thermal Design
    Techniques for Lowering Thermal Resistance
    Mechanical Design Considerations
    Thermal and Mechanical Simulation Tools
    Thermal and Mechanical Measurements
    References
    CERAMIC MATERIALS; Jerry E. Sergent
    Introduction
    Substrate Manufacturing
    Surface Properties of Ceramics
    Thermal Properties of Ceramic Materials
    Mechanical Properties of Ceramic Substrates
    Electrical Properties of Ceramics
    Processing of HTCC Substrates
    Processing of LTCC Substrates
    Applications
    References
    SCREEN PRINTING; Jerry E. Sergent
    Introduction
    The Screen
    The Stencil
    The Paste
    Critical Parameters of the Paste
    The Squeegee
    The Printing Process
    Screen Printer Setup and Operation
    Screen Printer Setup
    Geometric Effects on Print Thickness
    Measurement of Print Thickness
    Printing Considerations and Problems
    Inspecting Printed Films
    Glossary of Terms
    References
    MULTILAYER CERAMICS; Fred Barlow, Aicha Elshabini, and Arne K. Knudsen
    Introduction
    The Multilayer Ceramic Process
    Design Considerations
    Cofired Materials
    Future Trends
    References
    PHOTO-DEFINED AND PHOTO-IMAGED FILMS; William J. Nebe and Terry R. Suess
    Introduction
    Photo-Imaged Ceramic Processes
    PhotoPolymerization
    Photo-Formed Ceramic Compositions, Developed Using Organic Solvents
    Aqueous Developable Formulation
    Photocurable Conductive Pastes: Background
    Other Applications of Photocurable Paste Technology
    Acknowledgements
    References
    COPPER INTERCONNECTS FOR CERAMIC SUBSTRATES AND PACKAGES; Al Krum
    Introduction: Why Use Copper?
    Electrical Performance
    Thermal and Mechanical Properties of Copper
    Direct Bond Copper (DBC)
    Active Metal Brazing (AMB)
    Thick-Film Copper
    Thin Film
    Plated Copper
    References
    INTEGRATED PASSIVES IN CERAMIC SUBSTRATES; Heiko Thust and Jens Müller
    Introduction
    Materials and Technologies for Lumped Elements
    Design of Lumped Elements
    Trimming of Lumped Elements
    Lumped-Element Properties
    LTCC-Integrated Passive Devices
    Distributed Elements
    References
    INDEX

    Biography

    III Barlow, Aicha Elshabini