Fabrication of Silicon Microprobes for Optical Near-Field Applications

Phan Ngoc Minh, Ono Takahito, Esashi Masayoshi

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January 15, 2002 by CRC Press
Reference - 192 Pages - 130 B/W Illustrations
ISBN 9780849311543 - CAT# 1154

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Features

  • "Presents silicon micromachining techniques for producing efficient, reproducible microprobes for optical near-field applications
  • "Demonstrates applications in optical near-field imaging, lithography, and optical near-field recording using the fabricated probes and aperture arrays
  • "Develops instrumentation using the atomic force microscopy technique for near-field optical applications
  • "Describes novel methods for locally enhancing near-field light, such as apertures with a nano-metallic wire, a single carbon nanotube, or a small silver particle as scatterers
  • "Presents optical near-field and atomic force images with resolutions of about 15 nm and the first experimental results of optical near-field recording and reading of bits on a phase-change medium using the aperture array
  • "Contains more than 130 illustrations and 200 references
  • Summary

    The development of near-field optics marked a major advance in microscopy and our ability to develop nanoscale technologies. However, the tapered optical fiber widely in use as the optical near-field probe has serious limitations in its fabrication, its optical transmission efficiency, and its use in arrays.

    Fabrication of Silicon Microprobes for Optical Near-Field Applications reports on several technological approaches to using silicon micromachining techniques for fabricating microprobes without the drawbacks of conventional optical fiber probes. The authors have developed a simple, effective method for batch-process production of silicon cantilevered probes with apertures as small as 20 nanometers. They have investigated in detail the probes' optical performance characteristics and show how the silicon probes overcome the limitations of the optical fiber probes in terms of production throughput, optical throughput, reproducibility, simplicity of instrumentation, and mechanical performance.