Handbook of Lead-Free Solder Technology for Microelectronic Assemblies Karl J. Puttlitz, IBM, East Fishkill, New York, USA; Kathleen A. Stalter, IBM, Fishkill, New York, USA
Series:
Dekker Mechanical Engineering
Handbook of Nanoscience, Engineering, and Technology, Second Edition Editor(s): William A. Goddard III, California Institute of Technology, Pasadena, USA;
Donald Brenner, North Carolina State University, Raleigh, USA;
Sergey Edward Lyshevski, Rochester Institute of Technology, New York, USA;
Gerald J Iafrate, North Carolina State University, Raleigh, USA Publication Date: May 03, 2007
Price: $162.95
Electrochemical Microsystem Technologies Editor(s): J. Walter Schultze, Heinrich Heine Universit¿t, D¿sseldorf, Germany;
Tetsuya Osaka, University of Tokyo, Japan;
Madhav Datta, Cooligy, Inc., Mountain View, California, USA Publication Date: September 05, 2002
Price: $219.95
Powder Technology Handbook, Third Edition Editor(s): Hiroaki Masuda, Nishinomiya, Japan;
Ko Higashitani;
Hideto Yoshida, Hiroshima University, Japan Publication Date: January 13, 2006
Price: $173.95
Microelectronic Packaging Editor(s): M. Datta, Cooligy, Inc., Mountain View, California, USA;
Tetsuya Osaka, University of Tokyo, Japan;
J. Walter Schultze, Heinrich Heine Universit¿t, D¿sseldorf, Germany Publication Date: December 20, 2004
Price: $194.95
Price:$289.95 Cat. #: DK1274
ISBN:9780824748708 ISBN 10:0824748700 Publication Date: February 27, 2004
Number of Pages: 1,048
Availability: In Stock
Binding(s): Hardback | Available in e-book!
