Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics.
A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices!
Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses:
Introduction to Lead-Free Soldering Technology, K. Suganuma
Materials Science Concepts in Lead-Free Soldering, C. Handwerker, U. Kattner, and K. Moon
Alloy Selections, K. Nimmo
Plating Lead-Free Soldering in Electronics, H. Nawafune
Tin Whisker Discovery and Research, Y. Zhang
Mechanical Evaluation in Electronics, W.J. Plumbridge
Electrochemical Migration, H. Tanaka
Lead-Free Solder Paste and Reflow Soldering, S. Fujiuchi
Wave Soldering, T. Nishimura
Soldering Inspection and Design for Lead-Free Solder: Soldering Innovation by Trinity of Design,Process, and Inspection, M. Hirano
Future of Lead-Free Soldering, K. Suganuma
"…The authors are to be commended for the meticulous and thorough manner in which they have presented the information…of maximum value to…readers….essential"
-Guna Selvaduray, Ph.D., San Jose State University, California, U.S.A.
"…an excellent introduction."
-Ken Suetsugu, Panasonic, Pioneer of Lead-Free Soldering Technology
"There is a nice section on tin whiskers… .Yun Zhang covers the topic in relatively simple terms and describes a variety of process experiments."